We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Ultrasonic microscope.
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Ultrasonic microscope - Company Ranking(4 companies in total)

Last Updated: Aggregation Period:Apr 08, 2026〜May 05, 2026
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Company Name Featured Products
Product Image, Product Name, Price Range overview Application/Performance example
For more details, please download the PDF or feel free to contact us. For more details, please download the PDF or feel free to contact us.
【Specifications (Transmission Method)】 ■Device Used: Nordson SONOSCAN D9600 ■Acoustic Lenses: 15, 25, 30, 50, 100 MHz ■Maximum Measurement R... [Observation Case] ■ Numerous black spots were confirmed in the ultrasonic microscope images, and upon cross-sectional observation, signific...
【Other Specifications】 ■Maximum Measurement Range: 314mm × 314mm Minimum Pitch: 0.5μm ■Number of Images Acquired (1 Scan): 100 images (Gate... 【Applications】 ■ Semiconductor packages, substrates, electronic components: delamination at bonding interfaces, cracks, bump bonding ■ Resin...
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  1. Featured Products
    [Analysis Case Study] Observation of Adhesion State Through Metal Plates Using Ultrasonic Microscopy[Analysis Case Study] Observation of Adhesion State Through Metal Plates Using Ultrasonic Microscopy
    overview
    For more details, please download the PDF or feel free to contact us.
    Application/Performance example
    For more details, please download the PDF or feel free to contact us.
    Ultrasonic microscope observation of printed circuit boards.Ultrasonic microscope observation of printed circuit boards.
    overview
    【Specifications (Transmission Method)】 ■Device Used: Nordson SONOSCAN D9600 ■Acoustic Lenses: 15, 25, 30, 50, 100 MHz ■Maximum Measurement R...
    Application/Performance example
    [Observation Case] ■ Numerous black spots were confirmed in the ultrasonic microscope images, and upon cross-sectional observation, signific...
    Ultrasonic Microscope 'SAM'Ultrasonic Microscope 'SAM'
    overview
    【Other Specifications】 ■Maximum Measurement Range: 314mm × 314mm Minimum Pitch: 0.5μm ■Number of Images Acquired (1 Scan): 100 images (Gate...
    Application/Performance example
    【Applications】 ■ Semiconductor packages, substrates, electronic components: delamination at bonding interfaces, cracks, bump bonding ■ Resin...