Ultrasonic microscope - Company Ranking(4 companies in total)
Last Updated: Aggregation Period:Apr 08, 2026〜May 05, 2026
This ranking is based on the number of page views on our site.
Display Company Information
| Company Name | Featured Products | ||
|---|---|---|---|
| Product Image, Product Name, Price Range | overview | Application/Performance example | |
| For more details, please download the PDF or feel free to contact us. | For more details, please download the PDF or feel free to contact us. | ||
| 【Specifications (Transmission Method)】 ■Device Used: Nordson SONOSCAN D9600 ■Acoustic Lenses: 15, 25, 30, 50, 100 MHz ■Maximum Measurement R... | [Observation Case] ■ Numerous black spots were confirmed in the ultrasonic microscope images, and upon cross-sectional observation, signific... | ||
| 【Other Specifications】 ■Maximum Measurement Range: 314mm × 314mm Minimum Pitch: 0.5μm ■Number of Images Acquired (1 Scan): 100 images (Gate... | 【Applications】 ■ Semiconductor packages, substrates, electronic components: delamination at bonding interfaces, cracks, bump bonding ■ Resin... | ||
|
---
--- |
--- | ||
-
- Featured Products
-
[Analysis Case Study] Observation of Adhesion State Through Metal Plates Using Ultrasonic Microscopy
- overview
- For more details, please download the PDF or feel free to contact us.
- Application/Performance example
- For more details, please download the PDF or feel free to contact us.
Ultrasonic microscope observation of printed circuit boards.
- overview
- 【Specifications (Transmission Method)】 ■Device Used: Nordson SONOSCAN D9600 ■Acoustic Lenses: 15, 25, 30, 50, 100 MHz ■Maximum Measurement R...
- Application/Performance example
- [Observation Case] ■ Numerous black spots were confirmed in the ultrasonic microscope images, and upon cross-sectional observation, signific...
Ultrasonic Microscope 'SAM'
- overview
- 【Other Specifications】 ■Maximum Measurement Range: 314mm × 314mm Minimum Pitch: 0.5μm ■Number of Images Acquired (1 Scan): 100 images (Gate...
- Application/Performance example
- 【Applications】 ■ Semiconductor packages, substrates, electronic components: delamination at bonding interfaces, cracks, bump bonding ■ Resin...
-
Membership (free) is required to view all content.
Already a Member? Log In Here
アイテス